Semiconductor Packaging
Master semiconductor packaging from design to production with ASU & Intel. Learn industry-standard methods used in chip manufacturing and integration.
Master semiconductor packaging from design to production with ASU & Intel. Learn industry-standard methods used in chip manufacturing and integration.
This specialization, jointly developed by ASU and Intel, provides comprehensive training in semiconductor packaging fundamentals, manufacturing processes, and advanced technologies. Students learn essential concepts including length scales, transistor actions, and integrated circuit features. The program covers package anatomy, materials selection, manufacturing stages, and quality control. With a focus on practical industry applications, learners explore various packaging technologies, reliability assessment, and future trends in semiconductor packaging.
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What you'll learn
Understand fundamental semiconductor packaging concepts and terminology
Master package design principles and manufacturing processes
Learn quality control and reliability assessment techniques
Explore advanced packaging technologies and future trends
Develop skills in materials selection and testing
Gain practical knowledge of assembly methods
Skills you'll gain
This course includes:
24 Hours PreRecorded video
Assessments based on industry experiences
Access on Mobile, Tablet, Desktop
FullTime access
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There are 3 courses in this program
Introduction to Semiconductor Packaging
Course 1 · 10 Hours to complete · 9 modules
Semiconductor Packaging Manufacturing
Course 2 · 8 Hours to complete · 8 modules
Advanced Semiconductor Packaging
Course 3 · 6 Hours to complete · 6 modules
Fee Structure
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