Semiconductor Packaging Manufacturing
This course is part of Semiconductor Packaging.
This course cannot be purchased separately - to access the complete learning experience, graded assignments, and earn certificates, you'll need to enroll in the full Semiconductor Packaging Specialization program. You can audit this specific course for free to explore the content, which includes access to course materials and lectures. This allows you to learn at your own pace without any financial commitment.
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What you'll learn
Understanding semiconductor package manufacturing stages
Mastering process control systems implementation
Learning quality testing and monitoring techniques
Applying control charts for process improvement
Evaluating package assembly performance
Skills you'll gain
This course includes:
0.75 Hours PreRecorded video
6 quizzes, 1 assignment
Access on Mobile, Tablet, Desktop
FullTime access
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There are 8 modules in this course
This comprehensive course covers the various stages of semiconductor package manufacturing, including sort, assembly, and final testing. Students learn about process control systems, quality testing, and performance monitoring. The curriculum explores package selection, building, and testing with die components to ensure quality and assembly performance. Special emphasis is placed on identifying and correcting process problems using control charts and quality improvement techniques.
Welcome
Module 1 · 21 Minutes to complete
Introduction to Semiconductor Package Manufacturing 1
Module 2 · 58 Minutes to complete
Introduction to Semiconductor Package Manufacturing 2
Module 3 · 1 Hours to complete
Assembly Part 1
Module 4 · 1 Hours to complete
Assembly Part 2
Module 5 · 1 Hours to complete
Test and Finish
Module 6 · 1 Hours to complete
Process Control Systems (PCS)
Module 7 · 1 Hours to complete
Semiconductor Packaging Manufacturing Course Summary
Module 8 · 50 Minutes to complete
Fee Structure
Individual course purchase is not available - to enroll in this course with a certificate, you need to purchase the complete Professional Certificate Course. For enrollment and detailed fee structure, visit the following: Semiconductor Packaging
Instructor
Leading Expert in Materials Science and Engineering at Arizona State University
Terry Alford is a distinguished Professor and Associate Director of the School for Engineering of Matter, Transport and Energy at Arizona State University. He earned his Ph.D. in Materials Science and Engineering from Cornell University in 1991 and joined ASU's faculty in 1993. Professor Alford specializes in various aspects of materials science, including X-ray and electron diffraction, semiconductor processing, and the development of advanced materials for integrated circuits. His research focuses on critical topics such as silver and copper metallization, low-k dielectrics for future electronics, and the adhesion properties of sol-gel hydroxyapatite-metal systems for biomedical applications. In addition to his teaching responsibilities, he has contributed significantly to the academic community through numerous publications and research projects aimed at advancing materials characterization and processing techniques. His commitment to education and innovation positions him as a key figure in the field of materials science, helping to shape the future of engineering technologies.
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Frequently asked questions
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