This course is part of Semiconductor Packaging.
This course cannot be purchased separately - to access the complete learning experience, graded assignments, and earn certificates, you'll need to enroll in the full Semiconductor Packaging Specialization program. You can audit this specific course for free to explore the content, which includes access to course materials and lectures. This allows you to learn at your own pace without any financial commitment.
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English
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What you'll learn
Understand semiconductor packaging fundamentals and importance
Explore package anatomy from substrate to motherboard connections
Learn various package types and their design considerations
Master thermal and electrical management concepts
Analyze reliability factors and customer usage requirements
Skills you'll gain
This course includes:
0.8 Hours PreRecorded video
1 quiz, 7 assignments
Access on Mobile, Tablet, Desktop
FullTime access
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There are 9 modules in this course
This comprehensive course introduces the fundamentals of semiconductor packaging, covering essential concepts from length scales and transistor actions to package anatomy and function. Students learn about various package types, materials, design considerations, and reliability factors. The course explores how packaging connects silicon circuitry to systems, manages power and signals, enables cooling, and spans multiple length scales. Special emphasis is placed on modern challenges in nanoelectronics and heterogeneous integration.
Welcome
Module 1 · 21 Minutes to complete
Nanoelectronics
Module 2 · 1 Hours to complete
What is Packaging? Part 1
Module 3 · 1 Hours to complete
What is Packaging? Part 2
Module 4 · 1 Hours to complete
Anatomy of a Package Part 1
Module 5 · 1 Hours to complete
Anatomy of a Package Part 2
Module 6 · 1 Hours to complete
Anatomy of a Package Part 3
Module 7 · 1 Hours to complete
Anatomy of a Package Part 4
Module 8 · 1 Hours to complete
Introduction to Semiconductor Packaging Course Summary
Module 9 · 30 Minutes to complete
Fee Structure
Individual course purchase is not available - to enroll in this course with a certificate, you need to purchase the complete Professional Certificate Course. For enrollment and detailed fee structure, visit the following: Semiconductor Packaging
Instructor
Leading Expert in Materials Science and Engineering at Arizona State University
Terry Alford is a distinguished Professor and Associate Director of the School for Engineering of Matter, Transport and Energy at Arizona State University. He earned his Ph.D. in Materials Science and Engineering from Cornell University in 1991 and joined ASU's faculty in 1993. Professor Alford specializes in various aspects of materials science, including X-ray and electron diffraction, semiconductor processing, and the development of advanced materials for integrated circuits. His research focuses on critical topics such as silver and copper metallization, low-k dielectrics for future electronics, and the adhesion properties of sol-gel hydroxyapatite-metal systems for biomedical applications. In addition to his teaching responsibilities, he has contributed significantly to the academic community through numerous publications and research projects aimed at advancing materials characterization and processing techniques. His commitment to education and innovation positions him as a key figure in the field of materials science, helping to shape the future of engineering technologies.
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Frequently asked questions
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