Advanced Semiconductor Packaging
This course is part of Semiconductor Packaging.
This course cannot be purchased separately - to access the complete learning experience, graded assignments, and earn certificates, you'll need to enroll in the full Semiconductor Packaging Specialization program. You can audit this specific course for free to explore the content, which includes access to course materials and lectures. This allows you to learn at your own pace without any financial commitment.
4.7
(33 ratings)
1,622 already enrolled
Instructors:
English
ଓଡ଼ିଆ
Powered by
What you'll learn
Learn pathway for assembly and packaging technologies
Understand evolution of packaging impact on product performance
Master heterogeneous integration concepts
Explore 2D and 3D die-to-die interconnects
Analyze thermal management and signal integrity
Gain expertise in co-packaging optics
Skills you'll gain
This course includes:
0.65 Hours PreRecorded video
4 quizzes, 1 assignment
Access on Mobile, Tablet, Desktop
FullTime access
Shareable certificate
Get a Completion Certificate
Share your certificate with prospective employers and your professional network on LinkedIn.
Created by
Provided by
Top companies offer this course to their employees
Top companies provide this course to enhance their employees' skills, ensuring they excel in handling complex projects and drive organizational success.
There are 6 modules in this course
This comprehensive course introduces students to advanced semiconductor packaging technologies, focusing on 7-nanometer silicon and beyond. The curriculum covers the evolution and impact of packaging on product performance, heterogeneous integration techniques, interconnect optimization, thermal management, and signal integrity. Students learn about 2D and 3D die-to-die interconnects, multi-chip packages, and co-packaging optics for future systems.
Welcome
Module 1 · 20 Minutes to complete
Packaging Trends Part 1
Module 2 · 1 Minutes to complete
Packaging Trends Part 2
Module 3 · 1 Minutes to complete
Heterogeneous Integration Part 1
Module 4 · 1 Minutes to complete
Heterogeneous Integration Part 2
Module 5 · 1 Minutes to complete
Advanced Packaging End of Course Summary
Module 6 · 30 Minutes to complete
Fee Structure
Individual course purchase is not available - to enroll in this course with a certificate, you need to purchase the complete Professional Certificate Course. For enrollment and detailed fee structure, visit the following: Semiconductor Packaging
Instructor
Leading Expert in Materials Science and Engineering at Arizona State University
Terry Alford is a distinguished Professor and Associate Director of the School for Engineering of Matter, Transport and Energy at Arizona State University. He earned his Ph.D. in Materials Science and Engineering from Cornell University in 1991 and joined ASU's faculty in 1993. Professor Alford specializes in various aspects of materials science, including X-ray and electron diffraction, semiconductor processing, and the development of advanced materials for integrated circuits. His research focuses on critical topics such as silver and copper metallization, low-k dielectrics for future electronics, and the adhesion properties of sol-gel hydroxyapatite-metal systems for biomedical applications. In addition to his teaching responsibilities, he has contributed significantly to the academic community through numerous publications and research projects aimed at advancing materials characterization and processing techniques. His commitment to education and innovation positions him as a key figure in the field of materials science, helping to shape the future of engineering technologies.
Testimonials
Testimonials and success stories are a testament to the quality of this program and its impact on your career and learning journey. Be the first to help others make an informed decision by sharing your review of the course.
Frequently asked questions
Below are some of the most commonly asked questions about this course. We aim to provide clear and concise answers to help you better understand the course content, structure, and any other relevant information. If you have any additional questions or if your question is not listed here, please don't hesitate to reach out to our support team for further assistance.