Advanced Semiconductor Packaging
This course is part of Semiconductor Packaging.
This course cannot be purchased separately - to access the complete learning experience, graded assignments, and earn certificates, you'll need to enroll in the full Semiconductor Packaging Specialization program. You can audit this specific course for free to explore the content, which includes access to course materials and lectures. This allows you to learn at your own pace without any financial commitment.
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What you'll learn
Learn pathway for assembly and packaging technologies
Understand evolution of packaging impact on product performance
Master heterogeneous integration concepts
Explore 2D and 3D die-to-die interconnects
Analyze thermal management and signal integrity
Gain expertise in co-packaging optics
Skills you'll gain
This course includes:
0.65 Hours PreRecorded video
4 quizzes, 1 assignment
Access on Mobile, Tablet, Desktop
FullTime access
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There are 6 modules in this course
This comprehensive course introduces students to advanced semiconductor packaging technologies, focusing on 7-nanometer silicon and beyond. The curriculum covers the evolution and impact of packaging on product performance, heterogeneous integration techniques, interconnect optimization, thermal management, and signal integrity. Students learn about 2D and 3D die-to-die interconnects, multi-chip packages, and co-packaging optics for future systems.
Welcome
Module 1 · 20 Minutes to complete
Packaging Trends Part 1
Module 2 · 1 Minutes to complete
Packaging Trends Part 2
Module 3 · 1 Minutes to complete
Heterogeneous Integration Part 1
Module 4 · 1 Minutes to complete
Heterogeneous Integration Part 2
Module 5 · 1 Minutes to complete
Advanced Packaging End of Course Summary
Module 6 · 30 Minutes to complete
Fee Structure
Individual course purchase is not available - to enroll in this course with a certificate, you need to purchase the complete Professional Certificate Course. For enrollment and detailed fee structure, visit the following: Semiconductor Packaging
Instructor
Professor of Materials Science at Arizona State University
Dr. Terry Alford is a Professor and Associate Director at the School for Engineering of Matter, Transport and Energy at Arizona State University (ASU). He earned his doctorate in materials science and engineering from Cornell University in 1991 and has been a faculty member at ASU since 1993. Dr. Alford specializes in various aspects of materials science, particularly focusing on semiconductor processing, advanced materials issues, and the properties of metals. His extensive industrial experience includes roles in strategy, marketing, and product management within the telecommunications and process industries.On Coursera, Dr. Alford teaches a range of courses related to materials science and engineering, including "Introduction to Materials Science," "Advanced Semiconductor Packaging," and "Electrical Properties and Semiconductors." His courses aim to provide students with a comprehensive understanding of material properties, phase diagrams, and the intricacies of semiconductor packaging manufacturing. Through his teaching and research, Dr. Alford contributes significantly to the advancement of knowledge in materials science, preparing students for careers in this critical field.
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Frequently asked questions
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