Recent Advances in Freeform Electronics

Module 1 covers the fundamentals of electronics devices, focusing on solid physics and basic theory of MOSFET. Topics include electrical resistance, p-n junction, MOSFET (Metal Oxide Semiconductor Field-Effect Transistor), and SOI (Silicon-on-Insulator) Wafers.

Module 2 covers stretchable electronics, exploring various approaches to form stretchable electronic devices. Topics include foldable substrates, stretchable interconnects, high-resolution 3D printing, and 3D printing of liquid metal.

Module 3 focuses on transparent electrodes, covering conventional materials for transparent electrodes and their alternatives. The module explores various types of alternative electrodes and their applications.

Module 4 covers smart sensors, focusing on carbon nanomaterials-based FETs and transparent, wearable electronic devices. Topics include monolithic graphite-graphene FETs, hybrid materials-based FET sensors, smart contact lens technology, pressure & alcohol sensors, and transparent finger sensors.

Module 5 covers printed electronics, focusing on fundamentals of printing technologies and various electronics using E-jet printing. Topics include introduction to printing technology, fundamentals of E-jet printing, high-resolution applications, electronics applications, charged liquid printing, and biotechnology applications.

Module 6 focuses on high reliability for deformable electronics, covering newly developed materials for better reliability and their properties. Topics include cellulose research, hybrid film development, applications, high-performance devices, and metal nanofibers based devices.