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Introduction to Semiconductor Process 2
Explore advanced semiconductor processes including etching, thin film deposition, metallization, packaging, and 3D transistor technology.
Course Cost
₹ 2,699
Intermediate
Skill Level
5 Hours
Self-paced lessons
This course provides an in-depth exploration of advanced semiconductor processing techniques. It covers a wide range of topics including wet and dry etching, plasma technology, thin film deposition methods, metallization, chemical mechanical polishing, and electronic packaging. The curriculum also includes advanced concepts such as strain engineering, 2.5D/3D packaging, DRAM processes, and 3D transistor technology. Students will gain a comprehensive understanding of the principles and applications of these advanced semiconductor manufacturing processes, preparing them for careers in the semiconductor industry or further study in microelectronics.
English
What you'll learn
Understand the principles and applications of wet and dry etching in semiconductor processing
Explore plasma technology and its role in semiconductor manufacturing
Learn various thin film deposition techniques and their applications
Understand metallization processes and chemical mechanical polishing
Explore electronic packaging techniques, including advanced 2.5D/3D solutions
Gain insights into DRAM manufacturing processes
Study the latest developments in 3D transistor technology
Apply knowledge to solve practical semiconductor processing challenges
Skills you'll gain
This course includes:
196 Minutes PreRecorded video
9 assignments
Access on Mobile, Tablet, Desktop
FullTime access
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Share your certificate with prospective employers and your professional network on LinkedIn.
CREATED BY
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Top companies offer this course to their employees
Top companies provide this course to enhance their employees' skills, ensuring they excel in handling complex projects and drive organizational success.
There are 9 modules in this course
This course offers a comprehensive exploration of advanced semiconductor processing techniques. It covers nine key modules: Wet Etching, Plasma & Dry Etching, Thin Film Deposition (in two parts), Metallization and related processes, Electronic Packaging, Advanced 2.5D/3D Packaging, DRAM Process, and 3D Transistor Process. Students will learn about the principles and applications of various etching techniques, plasma technology, thin film deposition methods, and advanced packaging solutions. The curriculum also includes cutting-edge topics such as strain engineering, chemical mechanical polishing, and the latest developments in 3D transistor technology. Through a combination of video lectures, readings, and quizzes, learners will gain a deep understanding of the complex processes involved in modern semiconductor manufacturing, preparing them for careers in the semiconductor industry or further study in microelectronics.
Week 1 Wet Etch
Module 1 · 37 Minutes to complete
Week 2 Plasma & Dry Etch
Module 2 · 37 Minutes to complete
Week 3 Thin Film Deposition 1
Module 3 · 37 Minutes to complete
Week 4 Thin Film Deposition 2
Module 4 · 43 Minutes to complete
Week 5 Metallization, Chemical Mechanical Polishing, Strain Engineering
Module 5 · 39 Minutes to complete
Week 6 Electronic Packaging
Module 6 · 46 Minutes to complete
Week 7 Advanced Packaging 2.5D/3D
Module 7 · 41 Minutes to complete
Week 8 DRAM Process
Module 8 · 26 Minutes to complete
Week 9 3D Transistor Process
Module 9 · 25 Minutes to complete
Fee Structure
Payment options
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Faculties
These are the expert instructors who will be teaching you throughout the course. With a wealth of knowledge and real-world experience, they're here to guide, inspire, and support you every step of the way. Get to know the people who will help you reach your learning goals and make the most of your journey.
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Frequently asked Questions
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