Introduction to Semiconductor Process 2
Explore advanced semiconductor processes including etching, thin film deposition, metallization, packaging, and 3D transistor technology.
Explore advanced semiconductor processes including etching, thin film deposition, metallization, packaging, and 3D transistor technology.
This course provides an in-depth exploration of advanced semiconductor processing techniques. It covers a wide range of topics including wet and dry etching, plasma technology, thin film deposition methods, metallization, chemical mechanical polishing, and electronic packaging. The curriculum also includes advanced concepts such as strain engineering, 2.5D/3D packaging, DRAM processes, and 3D transistor technology. Students will gain a comprehensive understanding of the principles and applications of these advanced semiconductor manufacturing processes, preparing them for careers in the semiconductor industry or further study in microelectronics.
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What you'll learn
Understand the principles and applications of wet and dry etching in semiconductor processing
Explore plasma technology and its role in semiconductor manufacturing
Learn various thin film deposition techniques and their applications
Understand metallization processes and chemical mechanical polishing
Explore electronic packaging techniques, including advanced 2.5D/3D solutions
Gain insights into DRAM manufacturing processes
Skills you'll gain
This course includes:
196 Minutes PreRecorded video
9 assignments
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FullTime access
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There are 9 modules in this course
This course offers a comprehensive exploration of advanced semiconductor processing techniques. It covers nine key modules: Wet Etching, Plasma & Dry Etching, Thin Film Deposition (in two parts), Metallization and related processes, Electronic Packaging, Advanced 2.5D/3D Packaging, DRAM Process, and 3D Transistor Process. Students will learn about the principles and applications of various etching techniques, plasma technology, thin film deposition methods, and advanced packaging solutions. The curriculum also includes cutting-edge topics such as strain engineering, chemical mechanical polishing, and the latest developments in 3D transistor technology. Through a combination of video lectures, readings, and quizzes, learners will gain a deep understanding of the complex processes involved in modern semiconductor manufacturing, preparing them for careers in the semiconductor industry or further study in microelectronics.
Week 1 Wet Etch
Module 1 · 37 Minutes to complete
Week 2 Plasma & Dry Etch
Module 2 · 37 Minutes to complete
Week 3 Thin Film Deposition 1
Module 3 · 37 Minutes to complete
Week 4 Thin Film Deposition 2
Module 4 · 43 Minutes to complete
Week 6 Electronic Packaging
Module 6 · 46 Minutes to complete
Week 7 Advanced Packaging 2.5D/3D
Module 7 · 41 Minutes to complete
Week 8 DRAM Process
Module 8 · 26 Minutes to complete
Week 9 3D Transistor Process
Module 9 · 25 Minutes to complete
Fee Structure
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Instructor
Semiconductor Devices Expert
Dr. Keon Jae Lee is a professor at the Korea Advanced Institute of Science and Technology (KAIST), specializing in semiconductor devices. His research and academic contributions focus on advancing the field of semiconductors, with an emphasis on developing innovative materials and devices for various applications. Dr. Lee's work continues to influence the development of next-generation semiconductor technologies, making significant impacts in both academic and industry sectors. He teaches "Introduction to Semiconductor Devices" at KAIST.
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